Space-grade heat dissipation and EMC resin molding solutions
Achieving both heat dissipation and lightweight design! Plastic molded products for space environments with a focus on reliability.
SEKISUI has launched a new business that expands its plastic molding technology, developed for "heat dissipation" and "EMC control," into the field of space applications (development of components for rockets and satellites). Leveraging the molding know-how cultivated in automotive electrical components, we support the development of parts suitable for high-stress environments. By combining high-performance resin materials with heat diffusion properties and injection molding technology, we enable the integrated molding of complex shapes, enhancing the design flexibility of housings and covers. Structural optimization, including partial substitution of metal components, contributes to the reduction of the number of parts and processing man-hours. 【Features】 ■ Achieving both heat dissipation and lightweight design with high-performance resin materials ■ Improved design flexibility through integrated molding of complex shapes ■ Reduction of the number of parts through partial substitution of metal components ■ Compliance with electromagnetic waves, cosmic rays, and outgassing issues *For more details, please refer to the related links or feel free to contact us.
- Company：積水テクノ成型 新事業開発部
- Price：Other
